IC package with dual heat spreaders
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United States of America Patent
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-
Dec 4, 2001
Grant Date -
N/A
app pub date -
Sep 1, 1998
filing date -
Sep 1, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An integrated circuit device has a heat spreader attached to each of the major outer encapsulant surfaces. One or both of the heat spreaders has a pair of end posts configured for insertion into through-holes in a substrate to position and support the device during and following the outer lead solder reflow step at board assembly. The heat spreaders provide high heat dissipation and EMR shielding, and may be connected to the substrate ground to become ground planes.
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