Electronic package with interconnected chips
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United States of America Patent
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Dec 4, 2001
Grant Date -
N/A
app pub date -
Feb 4, 1998
filing date -
Feb 4, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electronic package which includes a circuitized substrate with a cavity and a first semiconductor chip positioned therein. The first chip is electrically coupled to conductive members located on the circuitized substrate. A second semiconductor chip is positioned on and electrically coupled to the first chip.
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