Multi-layer capacitor, wiring board, and high-frequency circuit
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United States of America Patent
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-
Dec 4, 2001
Issued Date -
N/A
app pub date -
Oct 4, 2000
filing date -
Oct 18, 1999
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A multi-layer capacitor includes first and second side-surface terminal electrodes alternately arranged on four side surfaces of a capacitor body. First and second major-surface terminal electrodes are arranged on a major surface of the capacitor body. First and second internal electrodes which are opposed to each other within the capacitor body are respectively electrically connected at ends thereof to the first and second side-surface terminal electrodes, and are also respectively electrically connected to the first and second major-surface terminal electrodes through via hole conductors. With this arrangement, the directions of the currents flowing within the multi-layer capacitor are diversified, and the lengths of current-carrying paths are shortened so as to achieve a very low ESL value.
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