Interconnect delay driven placement and routing of an integrated circuit design

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6327693
SERIAL NO

09290013

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

An EDA tool is provided with a placement and routing (P&R) module that optimizes placement and routing of an IC design in an interconnect delay driven manner. The P&R module systematically determines if it can improve (i.e. reduce) interconnect delay of the current critical interconnect routing path by determining if it can improve the interconnect delays of its constituting segments, each interconnecting two pins through a component. For each segment, the P&R module determines if the interconnect delay can be achieved by using different interconnect routing path interconnecting the two pins through the component replaced at a different location, and alternatively, through a logically equivalent component disposed at a different location.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • MENTOR GRAPHICS CORPORATION

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheng, Chung-Kuan 4407 Mensha Pl., San Diego, CA 92130 9 205
Yao, So-Zen 39586 Benavente Ave., Fremont, CA 94539 8 167

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation