Proppant containing bondable particles and removable particles
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United States of America Patent
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Dec 11, 2001
Issued Date -
N/A
app pub date -
Jul 14, 2000
filing date -
Jul 17, 1998
priority date (Note) -
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Abstract
An improved proppant and a method of increasing the conductivity of the fractures of subterranean formations is described. The proppant contains a mixture of bondable particles and removable particles. The bondable particles within a subterranean formation, adhere to adjacent bondable particles to form a permanent, self-supporting matrix and the removable particles from the self supporting matrix the ambient conditions of the fracture. The conductivity of the fracture and the overall productivity of the hyraulic operation is increased.
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