Thick-film paste with insoluble additive
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United States of America Patent
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Dec 11, 2001
Grant Date -
N/A
app pub date -
Jan 29, 1999
filing date -
Jan 29, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A thick-film paste for printing thick-film circuit elements, including solder stops, conductors, resistors and capacitors, and a method for using the paste. The paste has a composition that includes an organic vehicle, a filler material that contributes the desired electrical and/or material properties to the thick film fired from the paste, and an additive that is insoluble in the organic vehicle and contributes pseudoplastic Theological properties to the paste during printing. The additive also preferably evaporates, burns off, sublimates or is otherwise removed below the firing temperature of the paste.
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