Method of patterning organic polymer film and method for fabricating semiconductor device
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United States of America Patent
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Dec 11, 2001
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app pub date -
Feb 22, 2001
filing date -
Feb 22, 2000
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Abstract
An organic polymer film patterning method includes the steps of: defining a resist film on a selected area of a substrate; depositing an organic polymer film over the substrate by a plasma CVD process so that the resist film is covered with part of the organic polymer film; and removing the resist film along with the part of the organic polymer film that has covered the resist film.
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