Components with conductive solder mask layers
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United States of America Patent
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-
Dec 11, 2001
Grant Date -
N/A
app pub date -
Mar 26, 1999
filing date -
Mar 26, 1998
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A component for forming solder connections includes a diectric base having a non solder-wettable surface, a plurality of solder-wettable pads exposed to said surface, and an electrically conductive potential plane element having a non solder-wettable surface overlying the surface of the base in proximity to the pads but spaced from said pads. The non-wettable surface of the potential plane element may include a metal such as nickel or a metal oxide. The potential plane element thus performs the functions of a solder mask to prevent solder from forming short circuits between adjacent pads, and may also act as a ground plane, power plane or shielding element.
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