Microelectronic lead structures with dielectric layers
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United States of America Patent
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Dec 11, 2001
Grant Date -
N/A
app pub date -
Sep 18, 1996
filing date -
Sep 18, 1995
priority date (Note) -
In Force
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Abstract
A microelectronic connection component has flexible leads formed by polymeric strips with metallic conductors thereon. The metallic conductors may be very thin, desirably less than 5 microns thick, and provide good fatigue resistance. Each strip may have two conductors thereon, one serving as a principal or signal conductor for connection to a contact on a chip or other microelectronic element and the other serving as potential reference or ground conductor. The potential reference conductor on the lead provides enhanced resistance to crosstalk.
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