Micro ball grid array semiconductor device and semiconductor module
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Dec 11, 2001
Grant Date -
N/A
app pub date -
Mar 28, 2000
filing date -
Apr 26, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The semiconductor device includes a semiconductor chip and tapes. The tape includes insulating layers with the conductive layers which are sandwiched between the insulating layers. The tapes extend from the front surface to the back surface of the semiconductor chip and are fixed to the chip. Each of the conductive layers is exposed at the front and the back sides of the chip, respectively.
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