Bonding pads for integrated circuits having copper interconnect metallization
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United States of America Patent
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Dec 11, 2001
Grant Date -
N/A
app pub date -
Jul 1, 1999
filing date -
Jul 1, 1999
priority date (Note) -
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Abstract
A device having a thin metallic coating, such as tin which forms strong bonds to copper is provided on the bond pads of an integrated circuit having copper metallization; surface oxidation of the coating is self limiting and the oxides are readily removed, further the coated bond pad forms intermetallics at low temperatures making it both solderable and compatible with wire bonding. A low cost process for forming tin coated copper bonding pads is provided by electroless plating.
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