Modular thin film distributed filter
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Dec 11, 2001
Issued Date -
N/A
app pub date -
Sep 29, 2000
filing date -
Feb 25, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Modular thin film, distributed, lumped element band-pass filters. The filter circuitry is configured on a number of ceramic substrates. The component defining depositions are arranged to overlap and couple to one another with connecting vias. Alternative band-pass filter and delay line circuits are disclosed that provide desirable delay characteristics. Bordering ground conductors and covering ground planes shield lumped impedance resonator and overlapping capacitor elements and/or provide a hermetic seal between the layers. The assemblies are configured to accommodate a range of frequencies and permit pre-fabrication with subsequent laser trimming, assembly and packaging.
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