Apparatus and method for contacting a sensor conductive layer
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United States of America Patent
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Dec 11, 2001
Grant Date -
N/A
app pub date -
Dec 30, 1998
filing date -
Dec 30, 1998
priority date (Note) -
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Abstract
A structure and method is disclosed for grounding an electrostatic discharge device of an integrated circuit to dissipate electrostatic charges comprising an underlying dielectric layer disposed over capacitor plates of sensor circuitry and a conductive layer disposed over the underlying dielectric layer, wherein the conductive layer diffuses electrostatic charges at the surface of the integrated circuit to ground. The conductive material not only dissipates electrostatic charges to the ground, but may also protect at least a portion of the edge of the sensor chip from mechanical stress.
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