Method of electroplating non-conductive plastic molded products

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United States of America Patent

PATENT NO 6331239
SERIAL NO

09147292

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Abstract

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A method of electroplating non-conductive plastic moldings, the method comprising the steps of: applying a catalyst useful for electroless plating to non-conductive plastic moldings using a colloidal solution containing a precious metal compound and a stannous compound; forming an electrically conductive coating on the surface of the moldings using an electroless copper plating solution containing a copper compound, a saccharide having a reducing property, a complexing agent and an alkali metal hydroxide; and electroplating the coated moldings. According to the method, an electroplated coating excellent in appearance and properties can be formed on non-conductive plastic moldings by a simple procedure.

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Patent Owner(s)

Patent OwnerAddress
OKUNO CHEMICAL INDUSTRIES CO LTDJAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Okada, Jun Osaka, JP 100 999
Shirota, Hideki Kyoto, JP 1 37

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