Method of manufacture of a buckle plate ink jet printer
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United States of America Patent
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Dec 18, 2001
Grant Date -
N/A
app pub date -
Jul 10, 1998
filing date -
Jul 15, 1997
priority date (Note) -
Expired
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Abstract
This patent describes a method of manufacturing a a buckle plate ink jet print head wherein an array of nozzles are formed on a substrate utilizing planar monolithic deposition, lithographic and etching processes. Multiple ink jet heads are formed simultaneously on a single planar substrate such as a silicon wafer. The print heads can be formed utilizing standard VLSI/ULSI processing and can include integrated drive electronics formed on the same substrate. The drive electronics preferably being of a CMOS type. In the final construction, ink can be ejected from the substrate substantially normal to the substrate plane.
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