Process for etching thin-film layers of a workpiece used to form microelectric circuits or components
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United States of America Patent
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-
Dec 18, 2001
Issued Date -
N/A
app pub date -
Sep 24, 1998
filing date -
Mar 13, 1998
priority date (Note) -
Expired
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Abstract
A process for removing at least one thin-film layer from a surface of a workpiece pursuant to manufacturing a microelectronic interconnect or component is set forth. Generally stated, the process comprises the oxidation of at least a portion of the at least one thin-film layer and the etching of the oxidized thin-film layer using an etchant that selectively etches primarily the oxidized thin-film layer.
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