Multilayer electrical interconnection device and method of making same
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United States of America Patent
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Dec 18, 2001
Grant Date -
N/A
app pub date -
Aug 7, 1996
filing date -
Aug 7, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A multilayer, monolithic electrical interconnection device includes a substrate and a plurality of overlaying, alternating conducting and insulating layers deposited atop the substrate and one another. The layers are deposited by thermal spraying of respective insulating or conducting material through defined apertures in respective spray masks. Interlayer electrical connections are intrinsically formed by direct metallurgical bonding between the conducting material of an overlaying layer and the conducting material of a previously sprayed layer.
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