Method of making high density integral test probe
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United States of America Patent
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-
Dec 25, 2001
Grant Date -
Nov 15, 2001
app pub date -
Nov 23, 1998
filing date -
Nov 23, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A high density integrated test probe and method of fabrication is described. A group of wires are ball bonded to contact locations on the surface of a fan out substrate. The wires are sheared off leaving a stub, the end of which is flattened by an anvil. Before flattening a sheet of material having a group of holes is arranged for alignment with the group of stubs is disposed over the stubs. The sheet of material supports the enlarged tip. The substrate with stubs form a probe which is moved into engagement with contact locations on a work piece such as a drip or packaging substrate.
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