Microelectronic packages with solder interconnections
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 1, 2002
Grant Date -
N/A
app pub date -
Sep 18, 1998
filing date -
Sep 18, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A soldered assembly such as a packaged semiconductor chip includes elongated solder columns connected to the pads on the chip and a dielectric sheet having pads connected to the distal ends of the solder columns remote from the chip. Terminals on the sheet are connected to the pads of the sheet. The assembly can be handled and mounted using conventional surface-mount techniques, but provides thermal fatigue resistance. The solder columns may be inclined relative to the chip surface, and may contain long, columnar inclusions preferentially oriented along the lengthwise axes of the columns.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully