Semiconductor flip-chip package and method for the fabrication thereof
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United States of America Patent
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Jan 1, 2002
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N/A
app pub date -
Mar 2, 2000
filing date -
Jul 21, 1997
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Abstract
A flip-chip device and process for fabricating the device employs a multilayer encapsulant that includes a first portion encapsulant having a coefficient of thermal expansion of at most 30 ppm/.degree. C. and an elastic modulus of 2-20 GPa and a second portion comprising a polymer flux having a coefficient of thermal expansion that may exceed 30 ppm/.degree. C.
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