Method of fabricating an interconnection element
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United States of America Patent
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-
Jan 8, 2002
Issued Date -
N/A
app pub date -
May 26, 1995
filing date -
Nov 16, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Contact structures formed on an electronic component are useful for connecting the component to other electronic components. A contact tip structure can be formed on a sacrificial substrate, then combined with an interconnection element. A preferred contact structure includes some topography, generally in the form of certain raised features. These are formed by embossing depressed features into the sacrificial substrate upon which the contact tip structure is constructed. The contact tip structure can be optimized for making contact with another electrical component.
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