Apparatus for polishing leads of a semiconductor package
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United States of America Patent
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Jan 8, 2002
Grant Date -
N/A
app pub date -
Jul 22, 1998
filing date -
Sep 9, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus for polishing leads of a semiconductor package includes a package holder unit on which a plurality of semiconductor packages are arranged; and a polishing member that automatically polished the leads of the semiconductor package on the package holder unit. A mask may be used to cover the plurality of semiconductor packages to expose at least a part of the leads to the polishing member.
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