Method of making a circuitized substrate assembly with carrier having substrates therein
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jan 15, 2002
Issued Date -
N/A
app pub date -
Jan 3, 2000
filing date -
Jan 12, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of making an assembly comprised of several circuitized substrates, e.g., printed circuit boards, frictionally retained within a common carrier through the use of appropriate, paired locking means. The method is adapted for subsequent processing (e.g., electronic component attach) of the substrates while assuring substrate retention. Subsequently, the substrates can be readily separated (removed) from the carrier.
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