Electrical connection for wide-array inkjet printhead assembly with hybrid carrier for printhead dies
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United States of America Patent
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-
Jan 29, 2002
Grant Date -
N/A
app pub date -
Aug 25, 2000
filing date -
Aug 25, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A wide-array inkjet printhead assembly includes a carrier and a printhead die. The carrier includes a substrate and an electrical circuit. The substrate has a first side and a second side such that the electrical circuit is disposed on the second side of the substrate. The printhead die is mounted on the first side of the substrate and electrically coupled to the electrical circuit. Thus, electrical connection is established between the first side of the substrate and second side of the substrate.
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