Glass substrate chamfering method and apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6341999
SERIAL NO

09669684

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method for glass substrate chamfering using a metal-bonded outer-surface grindstone 12 for simultaneously processing the end surface and the oblique surfaces of the outer periphery of a doughnut-like glass substrate 1 with a circular hole 1a at the center thereof, and a metal-bonded inner-surface grindstone 14 for simultaneously processing the end surface and the oblique surfaces of the inner periphery are provided; the outer-surface grindstone and the inner-surface grindstone simultaneously grind end surfaces and oblique surfaces of the outer and inner peripheries of the glass substrate, and during grinding, the outer-surface grindstone is sharpened by dressing it electrolytically, and the inner-surface grindstone is sharpened by an electrolytic dressing when not processing as the glass substrate is being replaced. Thus, edge portions of the glass substrate for a hard disk can be processed accurately, efficiently, and with high quality, and the need for a subsequent process, such as buff-polishing, is reduced or even eliminated.

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Patent Owner(s)

  • THE NEXSYS CORPORATION;RIKEN;UTK SYSTEM CORPORATION;UTKSYSTEM CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Asami, Muneaki Tokyo, JP 3 11
Ohmori, Hitoshi Wako, JP 51 519
Shigitani, Sadamasa Hukuyama, JP 1 6
Uzawa, Akihiko Kanagawa, JP 2 11

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