Printed wiring board and manufacturing method thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 29, 2002
Grant Date -
N/A
app pub date -
Aug 7, 2000
filing date -
Jan 11, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A printed wiring board in which an opening existing around a pad which is a photovia land is arranged so that it is not overlapped with the pad, the area of an opening existing around a pad and that of another opening are equalized, the quantity of resin which is filled in each opening or is equalized throughout a printed wiring board and the quantity of resin overflowing from each opening or when resin is filled in each opening or is uniformed is provided. According to such a printed wiring board, a reliable printed wiring board wherein secure connection is enabled without causing disconnection can be realized when a circuit pattern provided on an interlayer insulating board formed on the printed wiring board and a conductor pad are connected by arranging an opening existing around a conductor pad so that it is not overlapped with the conductor pad and substantially equalizing the quantity of resin which is filled in an opening around a conductor pad and that of resin which is filled in another opening.
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Cited Art Landscape
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