Apparatus and process for pattern distortion detection for semiconductor process and semiconductor device manufactured by use of the apparatus or process

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United States of America Patent

PATENT NO 6343370
SERIAL NO

09203582

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Abstract

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A finished pattern that will be formed based on a design layout pattern in a semiconductor manufacturing process is predicted, and the outline of the predicted finished pattern is converted into a polygon. On the other hand, test reference patterns are formed based on the design layout pattern. A pattern distortion in the predicted finished pattern is detected by comparing the polygonized predicted finished pattern with the test referencepatterns. In converting the predicted finished pattern into a polygon, the number of apices of the polygon is reduced. Two kinds of test reference patterns are formed: an upper limit test reference pattern obtained by reducing the design layout pattern and defining an allowable upper limit and a lower limit test reference pattern obtained by enlarging the design layout pattern and defining an allowable lower limit.

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Patent Owner(s)

Patent OwnerAddress
RENESAS ELECTRONICS CORPORATIONTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Moriizumi, Koichi Tokyo, JP 14 257
Taoka, Hironobu Tokyo, JP 17 233

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