Polysilane composition for forming a coating suitable for bearing a metal pattern, metal pattern forming method, wiring board preparing method
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United States of America Patent
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-
Feb 5, 2002
Grant Date -
Aug 9, 2001
app pub date -
Oct 22, 1999
filing date -
Oct 22, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A metal pattern is prepared by applying a polysilane composition comprising a polysilane, a carbon functional silane, and a solvent onto a substrate to form a patterned coating of the polysilane composition, attaching catalytic metal nuclei to the patterned coating, and immersing the substrate in an electroless plating bath for thereby chemically depositing a metal film on the patterned coating.
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