Dimensionally stable core for use in high density chip packages and a method of fabricating same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6344371
APP PUB NO 20010029065A1
SERIAL NO

09136201

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A dimensionally stable core for use in high density chip packages is provided. The stable core is a metal core, preferably copper, having clearances formed therein. Dielectric layers are provided concurrently on top and bottom surfaces of the metal core. Metal cap layers are provided concurrently on top surfaces of the dielectric layers. Blind or through vias are then drilled through the metal cap layers and extend into the dielectric layers and clearances formed in the metal core. If an isolated metal core is provided then the vias do not extend through the clearances in the copper core. The stable core reduces material movement of the substrate and achieves uniform shrinkage from substrate to substrate during lamination processing of the chip packages. This allows each substrate to perform the same. Additionally, a plurality of chip packages having the dimensionally stable core can be bonded together to obtain a high density chip package.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
W. L. GORE & ASSOCIATES, INC.NEWARK, DE1119

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fischer, Paul J Eau Claire, WI 20 612
Gorrell, Robin E Eau Claire, WI 13 235
Sylvester, Mark F Eau Claire, WI 25 593

Cited Art Landscape

Patent Info (Count) # Cites Year
 
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INTERNATIONAL BUSINESS MACHINES CORPORATION (14)
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Allied-Signal Inc. (1)
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W. L. GORE & ASSOCIATES, INC. (9)
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5383788 Electrical interconnect assembly 42 1993
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Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (3)
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