US Patent No: 6,344,371

Number of patents in Portfolio can not be more than 2000

Dimensionally stable core for use in high density chip packages and a method of fabricating same

ALSO PUBLISHED AS: 20010029065

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Abstract

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A dimensionally stable core for use in high density chip packages is provided. The stable core is a metal core, preferably copper, having clearances formed therein. Dielectric layers are provided concurrently on top and bottom surfaces of the metal core. Metal cap layers are provided concurrently on top surfaces of the dielectric layers. Blind or through vias are then drilled through the metal cap layers and extend into the dielectric layers and clearances formed in the metal core. If an isolated metal core is provided then the vias do not extend through the clearances in the copper core. The stable core reduces material movement of the substrate and achieves uniform shrinkage from substrate to substrate during lamination processing of the chip packages. This allows each substrate to perform the same. Additionally, a plurality of chip packages having the dimensionally stable core can be bonded together to obtain a high density chip package.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
W. L. GORE & ASSOCIATES, INC.NEWARK, DE1108

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fischer, Paul J Louisville, KY 22 550
Gorrell, Robin E Eau Claire, WI 11 207
Sylvester, Mark F Eau Claire, WI 28 526

Cited Art Landscape

Patent Info (Count) # Cites Year
 
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5,129,142 Encapsulated circuitized power core alignment and lamination 84 1990
5,103,293 Electronic circuit packages with tear resistant organic cores 58 1990
5,224,265 Fabrication of discrete thin film wiring structures 96 1991
5,232,548 Discrete fabrication of multi-layer thin film, wiring structures 48 1991
5,301,118 Monte carlo simulation design methodology 67 1991
5,199,163 Metal transfer layers for parallel processing 23 1992
5,548,034 Modified dicyanate ester resins having enhanced fracture toughness 6 1992
5,523,148 Multilayer article comprising a toughened polycyanurate with embedded electrically conductive patterns 6 1994
5,527,593 Structures fabricated from toughened polycyanurate 5 1994
5,527,838 Toughened polycyanurate resins containing particulates 15 1994
5,529,836 Multilayer article comprising a toughened polycyanurate 6 1994
5,599,611 Prepreg and cured laminate fabricated from a toughened polycyanurate 18 1994
 
W. L. GORE & ASSOCIATES, INC. (9)
4,482,516 Process for producing a high strength porous polytetrafluoroethylene product having a coarse microstructure 215 1982
4,680,220 Dielectric materials 72 1985
4,985,296 Polytetrafluoroethylene film 193 1989
5,383,788 Electrical interconnect assembly 40 1993
5,498,467 Process for preparing selectively conductive materials by electroless metal deposition and product made therefrom 40 1994
5,753,358 Adhisive-filler polymer film composite 27 1996
5,841,075 Method for reducing via inductance in an electronic assembly and article 40 1998
5,919,329 Method for assembling an integrated circuit chip package having at least one semiconductor device 48 1998
5,970,319 Method for assembling an integrated circuit chip package having at least one semiconductor device 19 1999
 
GORE ENTERPRISE HOLDINGS, INC. (7)
5,034,801 Intergrated circuit element having a planar, solvent-free dielectric layer 58 1989
5,731,047 Multiple frequency processing to improve electrical resistivity of blind micro-vias 34 1996
5,863,446 Electrical means for extracting layer to layer registration 12 1996
5,868,950 Method to correct astigmatism of fourth yag to enable formation of sub 25 micron micro-vias using masking techniques 13 1996
5,879,787 Method and apparatus for improving wireability in chip modules 62 1996
5,910,255 Method of sequential laser processing to efficiently manufacture modules requiring large volumetric density material removal for micro-via formation 22 1996
5,965,043 Method for using ultrasonic treatment in combination with UV-lasers to enable plating of high aspect ratio micro-vias 20 1996
 
ADVANCED SEMICONDUCTOR ENGINEERING, INC. (1)
5,509,200 Method of making laminar stackable circuit board structure 60 1994
 
Allied Signal (1)
4,997,698 Ceramic coated metal substrates for electronic applications 34 1989
 
DYCONEX AG (1)
5,436,062 Process for the production of printed circuit boards with extremely dense wiring using a metal-clad laminate 39 1994
 
Exxon Research and Engineering Company (1)
5,652,284 Thermoplastic elastomer-asphalt nanocomposite composition 11 1995
 
HITACHI CHEMICAL COMPANY, LTD. (1)
5,638,598 Process for producing a printed wiring board 16 1995
 
LARRY W. BURGESS, (1)
4,642,160 Multilayer circuit board manufacturing 208 1985
 
Minnesota Mining and Manufacturing Company (1)
5,639,808 Flame retardant thermosettable resin compositions 15 1996
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
4,894,271 Metal-core printed wiring board and a process for manufacture thereof 16 1988
 
Photran Corporation (1)
5,512,390 Light-weight electrical-storage battery 10 1994
 
Satosen Co., Ltd. (1)
5,045,642 Printed wiring boards with superposed copper foils cores 21 1990
 
TOYOTA JIDOSHA KABUSHIKI KAISHA (1)
4,705,762 Process for producing ultra-fine ceramic particles 84 1985

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
AGILENT TECHNOLOGIES, INC. (4)
6,807,732 Methods for modifying inner-layer circuit features of printed circuit boards 1 2002
6,854,179 Modification of circuit features that are interior to a packaged integrated circuit 1 2002
7,010,766 Parallel design processes for integrated circuits 0 2004
7,234,232 Methods for designing and tuning one or more packaged integrated circuits 0 2005
 
INTEL CORPORATION (4)
6,867,491 Metal core integrated circuit package with electrically isolated regions and associated methods 1 2001
7,005,727 Low cost programmable CPU package/substrate 2 2002
7,413,936 Method of forming copper layers 1 2005
7,314,778 Wafer-level processing of chip-packaging compositions including bis-maleimides 2 2005
 
GENZYME CORPORATION (2)
8,323,675 Soft tissue prosthesis for repairing a defect of an abdominal wall or a pelvic cavity wall 2 2005
8,460,695 Making a soft tissue prosthesis for repairing a defect of an abdominal wall or a pelvic cavity wall 0 2012
 
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (2)
6,611,039 Vertically oriented nano-fuse and nano-resistor circuit elements 18 2001
7,378,598 Printed circuit board substrate and method for constructing same 1 2004
 
TRI-STAR LAMINATES, INC. (2)
8,323,798 Systems and methods for drilling holes in printed circuit boards 0 2008
8,802,237 Entry sheet for drilling holes in printed circuit boards 0 2012
 
VECTRAONE TECHNOLOGIES, LLC (2)
8,293,461 Direct emulsion process for making printed circuits 0 2008
8,313,891 Printed circuits and method for making same 0 2010
 
ENDICOTT INTERCONNECT TECHNOLOGIES, INC. (1)
8,198,551 Power core for use in circuitized substrate and method of making same 0 2010
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
7,863,183 Method for fabricating last level copper-to-C4 connection with interfacial cap structure 1 2006
 
LG INNOTEK CO., LTD. (1)
6,548,767 Multi-layer printed circuit board having via holes formed from both sides thereof 16 2000
 
LSI LOGIC CORPORATION (1)
6,492,736 Power mesh bridge 3 2001
 
PPG INDUSTRIES OHIO, INC. (1)
7,159,308 Method of making a circuit board 0 2005
 
UNIMICRON TECHNOLOGY CORP. (1)
8,058,561 Circuit board and manufacturing method thereof 0 2008
 
VIA TECHNOLOGIES, INC. (1)
6,981,320 Circuit board and fabricating process thereof 2 2003