Method of dicing workpiece
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United States of America Patent
Stats
-
Feb 5, 2002
Grant Date -
N/A
app pub date -
Jul 24, 2000
filing date -
Jul 28, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Disclosed is a dicing method using a dicing apparatus comprising at least a chuck table holding workpiece attached a frame via an adhesive tape, and dicing means for cutting a workpiece into small square pieces. The workpiece is cut into small square pieces in the state of being held in the frame, and a blow of air is ejected from the surface of the chuck table to the diced workpiece to expand the adhesive tape in the semispherical form. As a result, adjacent square pieces are put apart from each other, thus making adjacent square pieces even if they remain partly contiguous to be forcedly put apart from each other.
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Cited Art Landscape
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