Pulsed-mode RF bias for sidewall coverage improvement
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United States of America Patent
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Feb 5, 2002
Grant Date -
N/A
app pub date -
Dec 3, 1999
filing date -
Dec 3, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention provides a method and apparatus for achieving conformal step coverage of one or more materials on a substrate using sputtered ionized material. A target provides a source of material to be sputtered by a plasma and then ionized by an inductive coil, thereby producing electrons and ions. In one embodiment, one or both of the signals to the substrate and the target are modulated. Preferably, the modulated signal to the substrate includes a negative voltage portion and a zero voltage portion.
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