Packaged integrated processor and spatial light modulator
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Feb 12, 2002
Issued Date -
N/A
app pub date -
Aug 17, 2000
filing date -
Sep 30, 1999
priority date (Note) -
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status (Latency Note)
Importance
Abstract
An integrated circuit die may have a processor and a spatial light modulator formed in the same die. An opening may be provided in an interposer to allow light to reach the spatial light modulator. A plurality of bump bonds may space the interposer from the die region including the processor. Thus, a display may be formed in an integrated fashion with a processor.
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