Method and arrangement for rapid silicon prototyping
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United States of America Patent
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Feb 12, 2002
Grant Date -
N/A
app pub date -
Dec 18, 1998
filing date -
Dec 18, 1998
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Abstract
A rapid silicon processing arrangement significantly decreases the time from initial design to market introduction. Consistent with one embodiment of the present invention, rapid silicon processing arrangement uses a deconfigurable and extendible reference-chip development platform that includes a programmable device such as an electronically reconfigurable gate array and an off-platform bus for communicating with external devices. The reference-chip development platform can be deconfigured by deselecting communicative activity by one or more of functional block macros. The external devices can be used with the reference-chip development platform to test a hardware representation of the synthesized of the functional block macros in the programmable device within the reference-chip development platform as extended by the off-platform bus. The approach significantly decreases the development time, from initial design to market introduction.
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Patent Owner(s)
| Patent Owner | Address | |
|---|---|---|
| FUTURE LINK SYSTEMS | 3945 FREEDOM CIRCLE SUITE 900 SANTA CLARA CA 95054 |
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Inventor(s)
| Inventor Name | Address | # of filed Patents | Total Citations |
|---|---|---|---|
| Bapst, Mark | South Barrington, IL | 31 | 1048 |
| Payne, Robert | San Jose, CA | 37 | 942 |
| Pontius, Timothy | Lake in the Woods, IL | 10 | 224 |
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| Fee | Large entity fee | small entity fee | micro entity fee |
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| Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
| Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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