Method of manufacture for embedded processing subsystem module
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United States of America Patent
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Feb 19, 2002
Issued Date -
N/A
app pub date -
Nov 14, 2000
filing date -
Sep 25, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The inventive embedded processing subsystem module is adapted for backside circuit board assembly directly opposite of a specific microprocessor or Digital Signal Processor so that circuit groups such as memory banks and communications peripherals may utilize otherwise unused backside printed circuit board space underneath the processor device, and further so that high-speed signals interconnecting the processor and subsystem circuit devices traverse a minimized printed circuit track length.
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