Sacrificial bond pads for laser configured integrated circuits
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United States of America Patent
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Feb 19, 2002
Grant Date -
Feb 14, 2002
app pub date -
Jan 25, 1999
filing date -
Jan 25, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A bond pad structure is provided which has a primary bond pad region electrically connected to a secondary bond pad region. The secondary bond pad region is used to test a circuit for configuration, while the primary bond pad is covered with a protective oxide. After configuration and etching to complete desired disconnections, the oxide is removed from the primary bond pad region, leaving an undamaged surface for subsequent wire bonding. The primary bond pad region and the secondary bond pad region can be a unitary structure or two separate structures.
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