Integrated circuit with opposed spatial light modulator and processor
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United States of America Patent
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Feb 19, 2002
Grant Date -
N/A
app pub date -
Oct 29, 1999
filing date -
Oct 29, 1999
priority date (Note) -
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Abstract
An integrated circuit may have a spatial light modulator formed on one side of a semiconductor support and a microprocessor formed on the opposite side. The microprocessor and the spatial light modulator may communicate with one another through electrical connections which extend completely through the semiconductor support. The microprocessor may be contacted using bump packaging techniques.
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