Method and apparatus for tooless mating of liquid cooled cold plate with tapered interposer heat sink
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Feb 19, 2002
Grant Date -
N/A
app pub date -
Sep 29, 2000
filing date -
Sep 29, 2000
priority date (Note) -
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Abstract
A heat dissipating apparatus for use on a heat generating electric component inside a computer comprises an interposer mounted on the heat generating electric component and a heat absorbing member including a heat absorber, a bracing member, and a spring biasing said heat absorber toward the bracing member. The heat absorbing member is moveable between a first position in which the interposer is compressed between the heat absorber and the bracing member and a second position in which the interposer is not compressed between the heat absorber and the bracing member.
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