Semiconductor chip assembly with ball bond connection joint
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 26, 2002
Grant Date -
N/A
app pub date -
Sep 20, 2000
filing date -
Sep 20, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor chip assembly includes a semiconductor chip attached to a support circuit. The support circuit includes an insulative base, a conductive trace and a through-hole that extends through the conductive trace. A ball bond connection joint in the through-hole contacts and electrically connects the conductive trace and the pad. A method of manufacturing the assembly includes mechanically attaching the chip to the support circuit such that the through-hole exposes the pad, and then forming the ball bond in the through-hole using thermocompression or thermosonic wire bonding.
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