Semiconductor chip assembly with simultaneously electroplated contact terminal and connection joint
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 26, 2002
Grant Date -
N/A
app pub date -
Aug 22, 2000
filing date -
Aug 22, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor chip assembly includes a semiconductor chip attached to a support circuit. The support circuit includes an insulative base, a conductive trace and a through-hole between its top and bottom surfaces. The through-hole includes a top sidewall portion adjacent to the top surface and a bottom sidewall portion adjacent to the bottom surface. The conductive trace includes a pillar at the top surface and a routing line at the bottom sidewall portion. An electroplated contact terminal on the pillar extends above the base, and an electroplated connection joint in the through-hole contacts the routing line and the pad. Preferably, the connection joint is the only metal in the through-hole. A method of manufacturing the assembly includes simultaneously electroplating the contact terminal and the connection joint.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully