Formulation of conductive putty
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United States of America Patent
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Feb 26, 2002
Grant Date -
N/A
app pub date -
Jan 11, 2000
filing date -
Nov 5, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A formulation of conductive putty is disclosed for forming a uniform coating on the surface of a metallic product prior to painting. The formulation of the putty comprises a ketone solvent, epoxy resin, calcium carbonate clay, pigment and metallic powder having a specific conductance. Use of the putty simplifies the finishing procedure, decreases the weight and thickness of the finished product, decreases handling cost and results in a product having an improved appearance.
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