Multiple die stack apparatus employing T-shaped interposer elements
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United States of America Patent
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Feb 26, 2002
Grant Date -
N/A
app pub date -
Feb 8, 1999
filing date -
Feb 8, 1999
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Abstract
Multiple integrated circuit devices in a stacked configuration that uses a spacing element for allowing increased device density and increased thermal conduction or heat removal for semiconductor devices and the methods for the stacking thereof.
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