Low profile laminated shunt
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United States of America Patent
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-
Feb 26, 2002
Grant Date -
N/A
app pub date -
Sep 29, 1999
filing date -
Sep 29, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A low profile shunt has an electrically insulated substrate with opposing electrical terminals joined to a sensing device by two electrically conductive layers. The conductive layers are laminated on each side of a shunt layer extending between the terminals. An insulating tape insulates the copper foil conductive and shunt layers from each other between the terminals. The sensing element is a measuring resistor having a resistive value many times greater than that of the shunt layer such that relatively low current measurements may by made at the sensing element.
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