Method of making conductive bump on wiring board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 5, 2002
Grant Date -
Aug 23, 2001
app pub date -
May 15, 1998
filing date -
Mar 6, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A wiring board structure has an insulating base having at least one projection located thereon, wherein the insulating base and the at least one projection are integrally formed from a same piece of insulating material. The wiring board structure also has at least one lead located on the insulating base, wherein a part of the at least one lead covers the at least one projection to form at least one conductive bump.
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