Thermoelectric cooling device using heat pipe for conducting and radiating
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United States of America Patent
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-
Mar 5, 2002
Grant Date -
N/A
app pub date -
Nov 17, 2000
filing date -
Mar 30, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A thermoelectric cooling device using heat pipes for heat conducting and dispersing, comprising a multi-bundle of the heat pipe conducting plates installed at the cold end of the thermoelectric cooling member and converged to condenser, a multi-bundle of the heat pipe heat exchangers installed at the hot end of the thermoelectric cooling member with fin plates or fin stripes and converged to the evaporator. It performs a fast cooling and heat dispersing by heat pipes and high efficient phase change and heat transport of the working medium. It can eliminate the heat exchange produced by the heat accumulation on the cold and hot ends, so as to run at the minimum operation temperature differences in order to obtain the maximum cooling capacity.
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