Soldering device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 5, 2002
Issued Date -
N/A
app pub date -
May 1, 2000
filing date -
Nov 7, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A soldering apparatus has a solder container and a casing to accommodate a protective-gas atmosphere for soldering printed circuit boards. During transport of the circuit boards through a casing the circuit boards are brought into contact with a solder wave in the container. The casing has an inlet for printed circuit board on an inlet side and an outlet on its outlet side. In addition, the casing has a supply of non-oxidizing gas and an arrangement for admitting gas into the casing. The casing is designed as a modular construction kit having subassemblies and/or constructional elements which comprise an input tunnel, an entry tunnel, at least two covering elements, an outlet tunnel and a detachable connection on the solder container and/or the sub-assemblies and/or constructional elements to connect the sub-assemblies and/or constructional elements and the solder container.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully