Integrated electrodeposition and chemical mechanical polishing tool
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United States of America Patent
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Mar 5, 2002
Issued Date -
N/A
app pub date -
Jun 8, 2000
filing date -
Nov 10, 1997
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A fabrication tool integrates one or more electrodeposition stations with a CMP apparatus. The tool may transport substrates from the electroplating stations to the CMP apparatus without an intervening cleaning step. In addition, the thickness of an electrodeposited layer may be measured at a metrology station prior to polishing utilizing an instrument which physically contacts the surface of the substrate, and the measured thickness may be used to adjust the polishing parameters. Furthermore, the fabrication tool may have a single interface in which a dry and clean wafer is returned to the interface.
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