Poly(phenylene ether)-polyvinyl thermosetting resin
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United States of America Patent
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Mar 5, 2002
Grant Date -
Dec 20, 2001
app pub date -
Dec 1, 1999
filing date -
Dec 1, 1999
priority date (Note) -
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Abstract
A capped poly(phenylene ether) resin composition is formed from (1) a poly(phenylene ether) compound (PPE) in which at least a portion, preferably substantially all of the hydroxyl groups have been reacted with a compound containing ethylenic unsaturation (carbon-carbon double bonds) which is further reactive with unsaturated monomers (reactively endcapped PPE) and (2) a curable unsaturated monomer composition. The composition optionally contains a polymerization catalyst; a flame-retardant compound; and fibrous reinforcement. The composition can be cured to form a laminate, and clad with copper to form a circuit board.
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