Interleaved signal trace routing
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United States of America Patent
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Mar 5, 2002
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N/A
app pub date -
Mar 14, 2001
filing date -
Jun 11, 1998
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Abstract
A multi-layer electronic device package includes first and second outer layers and at least one signal layer disposed between the outer layers. The signal layer includes signal traces and ground traces interleaved with the signal traces. A method of routing signal traces in an electronic device package includes the acts of disposing a plurality of signal traces in at least one substrate layer, and interleaving a plurality of ground traces with the signal traces.
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