Method for stripping organic based film
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United States of America Patent
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Mar 5, 2002
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app pub date -
Apr 27, 1998
filing date -
Apr 27, 1998
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Abstract
There is provided a method used for processing an organic low dielectric constant insulating film to a desired shape for enabling facilitated stripping of an organic film formed on top of the organic low dielectric constant insulating film. Specifically, there is provided a method for stripping an organic film formed on a layered unit having at least an organic low dielectric constant insulating film. This method includes generating radicals in a gas mainly composed of fluorine-based gas, and stripping the organic film by the generated radicals.
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