Importance

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Abstract

In a semiconductor device, a stacked semiconductor chip includes semiconductor chips having a principal surface on which pads are arranged and a back surface, an upper semiconductor chip being bonded to the principal surface of a lower semiconductor chip and shifted like stairs and not covering pads. A back surface of the stacked semiconductor chip is fixed to one surface of a die pad of a lead frame where a sunken die pad sink is located. The pads on the stacked semiconductor chip and corresponding inner leads are connected via metal wires by backward wire bonding, and major surfaces of the inner leads, the stacked semiconductor chip, the metal wires, the jointing materials, and the die pad are covered with a sealing material with the back surface of the die pad exposed at an outer surface of the sealing resin.

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First Claim